MEMS standard fabrication process development

1.Deep RIE technology；
2.Poly-epitaxy technology；
3.Anti-stiction during release process；
4.Wafer level low temperature package;
5.Low stress film deposition technology.

Expected Targets and Technical Indices ：

Develop one standard MEMS fabrication process, which is applicable to many MEMS sensors such as accelerometer, gyroscope and resonator etc.