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MEMS standard fabrication process development

Jiangsu Center of International Technology Transfer

               Country: China
        Release time: 2017-12-04
              Industry: Others>Others

1.Deep RIE technology;
2.Poly-epitaxy technology;
3.Anti-stiction during release process;
4.Wafer level low temperature package;
5.Low stress film deposition technology.

Expected Targets and Technical Indices :

Develop one standard MEMS fabrication process, which is applicable to many MEMS sensors such as accelerometer, gyroscope and resonator etc.