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MEMS standard fabrication process development
Jiangsu Center of International Technology Transfer
1.Deep RIE technology；
3.Anti-stiction during release process；
4.Wafer level low temperature package;
5.Low stress film deposition technology.
Expected Targets and Technical Indices ：
Develop one standard MEMS fabrication process, which is applicable to many MEMS sensors such as accelerometer, gyroscope and resonator etc.